InP-Based Epitaxial Wafers
InP epitaxial wafers are engineered for high-speed optical communications and RF devices, supporting 1.3–1.55 µm optical communications, DFB/EML lasers, PIN/APD photodetectors, and mmWave HEMT/HBT applications.
Select a wafer type to view detailed specs
Export of this product is regulated by the Ministry of Commerce of the PRC (MOFCOM). An export license must be obtained prior to shipment. Contact our compliance team for details.
Export of this product is regulated by the Ministry of Commerce of the PRC (MOFCOM). An export license must be obtained prior to shipment. Contact our compliance team for details.
Export of this product is regulated by the Ministry of Commerce of the PRC (MOFCOM). An export license must be obtained prior to shipment. Contact our compliance team for details.
InP epitaxial wafers are engineered for high-speed optical communications and RF devices, supporting 1.3–1.55 µm optical communications, DFB/EML lasers, PIN/APD photodetectors, and mmWave HEMT/HBT applications.
GaSb epi wafers are tailored for mid-wave and long-wave infrared (MWIR/LWIR) detection and imaging. Featuring Type-II superlattice (T2SL) structures, they enable high-performance T2SL detectors and gas sensing systems.
GaAs epitaxial wafers serve 5G/6G RF front-ends, near-infrared lasers, and high-brightness LEDs. Typical applications include 5G/6G pHEMT/HBT devices, VCSEL/near-IR laser diodes, red/yellow LEDs, and photoconductive switches.
Quick answers on material selection, customization, testing and ordering.
Yes, we support custom epitaxial growth. To initiate the process, customers must provide a complete epi-stack design (including layer sequence, composition, thickness, and doping profiles). Our engineering team will review the structure to assess growth feasibility and process compatibility before proceeding.
To provide an accurate quote, please specify: Material system (e.g., InP, GaAs), wafer diameter, crystal orientation, layer structure, layer thickness, doping requirements, quantity, and target device application.
We implement strict in-process quality control to guarantee wafer consistency. Every shipment includes full traceability and a Certificate of Analysis (CoA)
Technical Inquiry
Share your material, dimensions, specifications, application or project stage. Our team will review your requirements and respond within one business day.
Engineering-led response
Inquiries are routed to the appropriate technical or commercial team.
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No. 1389, Lianmei Road, Lianhua Industrial Zone, Tong’an, Xiamen, Fujian 361100, China
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