III-V Semiconductor Epitaxial Wafer | Power Wafertech Group

III-V Semiconductor Epitaxial Wafers

III-V Semiconductor Epitaxial Wafer

PWG offers epitaxial solutions based on InP, GaSb and GaAs substrates, covering heterostructures for HEMTs, pHEMTs, HBTs, laser diodes, photodetectors, VCSELs, infrared detectors and other III-V devices.
  • Substrate InP, GaSb, and GaAs
  • Growth Method MOCVD and MBE
  • Specs standard, custom
  • Epi type HEMT / pHEMT / HBT/ LD / VCSEL / photodetector / T2SL etc.
  • Packaging Single wafer cassette, vacuum sealed
Detailed Specifications

Published specifications by wafer diameter.

Select a diameter to review the corresponding published specification set.

Material SystemTypical StructureKey PropertiesPrimary Applications
InGaAs/InPPIN/APD Detector HEMT ChannelHigh electron mobility Absorption at 1.3-1.55µmHigh-speed optical receivers, mmWave HEMTs
InGaAsP/InPMultiple Quantum Well Laser StructuresDirect bandgap Tunable wavelengthDFB Lasers, EMLs, Electro-absorption modulators (EAM), Optical amplifiers
InAlAs/InGaAs/InP2DEG heterostructureBetter gain Lower noise Higher power efficiencyultra-high-speed HEMTs and HBTs
Applications

Where this wafer delivers value

01

InGaAs/InP

High-speed optical receivers, mmWave HEMTs | Typical Structure: PIN/APD Detector HEMT Channel | Key Properties: High electron mobility Absorption at 1.3-1.55µm

02

InGaAsP/InP

DFB Lasers, EMLs, Electro-absorption modulators (EAM), Optical amplifiers | Typical Structure: Multiple Quantum Well Laser Structures | Key Properties: Direct bandgap Tunable wavelength

03

InAlAs/InGaAs/InP

ultra-high-speed HEMTs and HBTs | Typical Structure: 2DEG heterostructure | Key Properties: Better gain Lower noise Higher power efficiency

04

InAs/GaSb (Type-II superlattice)

High-performance MWIR & LWIR Imaging | Typical Structure: T2SL IR Detector Structures | Key Properties: Broad spectral coverage (extendable >14µm)

05

InGaAsSb/GaSb, AlGaAsSb/GaSb

Mid-IR Lasers for gas sensing | Typical Structure: Quantum Well Laser Structures | Key Properties: Direct bandgap, Mid-IR emission

06

GaSb-based thermophotovoltaic (TPV) structures

TPV cells | Typical Structure: PIN structure | Key Properties: High-efficiency energy conversion

07

AlGaAs/GaAs

5G/6G RF HEMTs, Near-IR Laser Diodes (LDs) | Typical Structure: Quantum Wells, Heterostructures | Key Properties: High electron mobility Direct bandgap

08

InGaP/GaAs

RF Power Amplifiers (HBTs) | Typical Structure: HBT Structures | Key Properties: High breakdown voltage High efficiency

09

InGaAs/GaAs (Strain Layer)

mmWave LNAs, High-speed switches | Typical Structure: pHEMT Structures | Key Properties: Very high electron mobility & velocity

10

AlGaInP/GaAs

High-brightness Red, Yellow, Orange light emitting diodes (LEDs) | Typical Structure: Multiple Quantum Well Structures | Key Properties: Direct bandgap Red-Yellow spectrum

11

Low Temperature GaAs (LT-GaAs)

Terahertz photoconductive antennas, Ultra-fast photodetectors | Typical Structure: Low-Temperature Grown GaAs (LTG-GaAs) Layer | Key Properties: Ultra-high resistivity Ultra-fast carrier lifetime

FAQ

Common questions about this product

Quick answers on material selection, customization, testing and ordering.

Please provide the substrate material, wafer diameter, crystal orientation, layer structure, layer thickness, composition, doping requirements, quantity and target device.

Yes. If you do not have a finalized layer structure, our technical team can discuss the target device, wavelength, frequency or performance requirements and recommend a suitable epitaxial structure.

Yes. We can customize layer composition, thickness, doping, quantum-well structures, buffer layers, cap layers and superlattice designs.

Technical Inquiry

Speak to Engineers About Your Wafer Needs

Share your material, dimensions, specifications, application or project stage. Our team will review your requirements and respond within one business day.

Engineering-led response

Inquiries are routed to the appropriate technical or commercial team.

Address

No. 1389, Lianmei Road, Lianhua Industrial Zone, Tong’an, Xiamen, Fujian 361100, China

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Emailvictorchan@powerwafertech.com Phone+86-592-5633652